Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process. • Royalty Free Stock Photo

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Shutterstock ID 2262331367
Added February 15, 2023 (1 year ago)
Ratio 1.7778
Adult NO
Med size (JPG) 1000 x 563 px, 0.3 Mb, 300 DPI
Small size (JPG) 500 x 282 px, 0.1 Mb, 300 DPI
Huge size (JPG) 6400 x 3600 px, 7.7 Mb, 300 DPI

Categories: Technology Industrial

Foundry Die Electronics Advanced Fab Research Shortage Manufacturing Nanotechnology Development Package Fabrication Cpu Equipment Gpu Processor Cleanroom Microcontroller Wafer Science Disc Device Circuit Memory Production Semiconductor Line Robotics Industry Microchip Integrated Computer Chipmaker Arm Make Factory Chip Controller Process Packaging Lithography Pick and place Technology Photolithography Component Industrial Silicon Machine Facility Transistor


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Foundry Die Electronics Advanced Fab Research Shortage Manufacturing Nanotechnology Development Package Fabrication Cpu Equipment Gpu Processor Cleanroom Microcontroller Wafer Science Disc Device Circuit Memory Production Semiconductor Line Robotics Industry Microchip Integrated Computer Chipmaker Arm Make Factory Chip Controller Process Packaging Lithography Pick and place Technology Photolithography Component Industrial Silicon Machine Facility Transistor


Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process. is royalty free stock photo by IM Imagery.
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