Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process. • Royalty Free Stock Photo
Royalty Free Stock Image from Shutterstock 2262331367 by IM Imagery
Shutterstock ID | 2262331367 |
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Added | February 15, 2023 (1 year ago) |
Ratio | 1.7778 |
Adult | NO |
Med size (JPG) | 1000 x 563 px, 0.3 Mb, 300 DPI |
Small size (JPG) | 500 x 282 px, 0.1 Mb, 300 DPI |
Huge size (JPG) | 6400 x 3600 px, 7.7 Mb, 300 DPI |
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Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process. is royalty free stock photo by IM Imagery.
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