Semiconductor Packaging Process. Close-up of Extracted from Semiconductor Wafer Silicon Dies are being Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. • Free Stock Video / Footage
Royalty Free Stock Video / Footage from Shutterstock 1099853293 by IM Imagery
Shutterstock ID | 1099853293 |
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Added | February 6, 2023 (1 year ago) |
Ratio | 1.778 |
Duration | 00:12 |
Aspect ratio | 16:9 |
Adult | NO |
Low Resolution size (MOV) | 426 x 240 px, 0.7 Mb, 25 FPS |
Standard Definition size (MOV) | 852 x 480 px, 2.1 Mb, 25 FPS |
HD size (MOV) | 1920 x 1080 px, 10.3 Mb, 25 FPS |
Original UltraHD 4k size (APCH) | 3840 x 2160 px, 1,155.9 Mb, 25 FPS |
Semiconductor Packaging Process. Close-up of Extracted from Semiconductor Wafer Silicon Dies are being Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. is royalty free stock photo by IM Imagery.
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